半导体设备自动化和智能化程度很高。作为黑灯工厂,工厂就必须做到高度自动化。设备和工厂通过什么方式进行关联起来呢,半导体行业提出了相关的semi标准。
金南瓜科技www.secsgem.cn
1。 基本的通讯层:SECS/GEM
也称为GEM200
E4 SECS I(SPECIFICATION FOR SEMI EQUIPMENT COMMUNICATIONS
STANDARD 1 MESSAGE TRANSFER)
E37 HSMS (SPECIFICATION FOR HIGH-SPEED SECS MESSAGE SERVICES)
E5 SPECIFICATION FOR SEMI EQUIPMENT COMMUNICATIONS
STANDARD 2 MESSAGE CONTENT
E30 GEM SPECIFICATION FOR THE GENERIC MODEL FOR COMMUNICATIONS
AND CONTROL OF MANUFACTURING EQUIPMENT
2。 GEM300(300mm):复杂和应用更高级的场景
E40 (PROCESSING MANAGEMENT)
E84 (ENHANCED CARRIER HANDOFF PARALLEL I/O INTERFACE)
E87 (CARRIER MANAGEMENT (CMS))
E90(SUBSTRATE TRACKING)
E94(CONTROL JOB MANAGEMENT)
E116(EQUIPMENT PERFORMANCE TRACKING)
E157(MODULE PROCESS TRACKING)
3。Interface A(EDA): 提供大数据的处理接口
E120(THE COMMON EQUIPMENT MODEL)
E125 (EQUIPMENT SELF DESCRIPTION)
E132 (EQUIPMENT CLIENT AUTHENTICATION AND AUTHORIZATION)
E134(DATA COLLECTION MANAGEMENT)
E164(EDA COMMON METADATA)